ALPHA®OM-338-T 是一款无铅免清洗锡膏，设计用于多种应用。ALPHA OM-338-T 较宽的加工窗口设计用于最大程度减少从锡/铅到无铅锡膏的过渡问题。这种材料被设计为具有与锡铅工艺相媲美的性能。*ALPHA OM-338-T 在多种电路板设计上都能产生出色的印刷能力性能，尤其是在具有超精细特征重复性（11 平方密尔）和高吞吐量的应用中。
出色的回流工艺窗口提供了良好的 CuOSP 焊接性，能够出色地熔融愈合多种沉积尺寸，具有出色的抗随机锡珠形成性以及片式元件间锡珠性能。ALPHA OM-338-T 采用的配方可产生出色的焊点外观。此外，ALPHA OM-338-T 的 IPC III 类空洞和 ROL0 IPC 分类能力确保了最大程度提高长期产品可靠性。ALPHA OM-338-T 也被称为具有 M13 粘度的 ALPHA OM-338。
特点和优势
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
- Excellent print consistency with high process capability index across all board designs.
- Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
- Wide reflow profile window with good solderability on various board / component finishes.
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- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III.
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
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