ALPHA®OM-340 是一款无铅免清洗锡膏，设计用于多种应用。ALPHA OM-340 具有同类产品中最低的球窝缺陷率，并且在电路内测试/引脚测试中实现了出色的首次通过良率。ALPHA OM-340 在多种电路板设计上也能产生出色的印刷能力性能，尤其是在具有超精细特征重复性和高“吞吐量”的应用中。
出色的回流工艺窗口提供了出色的 CuOSP 焊接性，能够出色地熔融愈合多种沉积尺寸，具有出色的抗随机锡珠形成性以及片式元件间锡珠性能。ALPHA OM-340 采用的配方可产生出色的焊点外观，以及同类产品中最高的电路内引脚测试良率。此外，ALPHA OM-340 的 IPC III 类空洞和 ROL0 IPC 分类能力确保了最大程度提高长期产品可靠性。
特点和优势
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
- Excellent print consistency with high process capability index across all board designs
- Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Best in class low defect rate for Head in Pillow
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- Best in class in circuit pin test yield
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
- Zero halogen (No halogen intentionally added to the formulation)
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